Advanced Image Sensing Technology

Our sensing technology goes beyond traditional imaging, delving deeply into integrating multiple types of sensors to achieve seamless data fusion and intelligent decision-making. For example:

• Combining image technology with IMU enables image stabilization.
• Integrating image technology with PIR or millimeter-wave sensors triggers video recording only within the detection range, optimizing energy efficiency.
• Merging image technology with ToF combines 2D images with depth data to create 3D visualizations.

IMU

• G-sensor
  3 axis MEMS
• Gyro
  3-axis MEMS
• E-Compass
  1300μT (x-, y-axis)

Temperature

• Analog type
  55°C to +130°C / ±1.5°C / Linear
• Digital type
  40°C to +125°C / ±0.5°C / Digital Output (I2C)
• NTC Thermistor
  40°C to +125°C / ±1°C

Pressure

• 260 ~ 1260 hPa
• 0.01 hPa RMS / 24-bit
• 1 Hz ~ 25 Hz (ODR)
• SPI / I2C / FIFO

Humidity

• Embedded PTFE filter
• ±5%RH max tolerance @ 55%RH
• IP67 / I2C

Light Sensor

• Analog
  0 ~ 400 Lux / 320nm ~ 750nm / ±30% / Voltage Output
• Digital
  0 ~ 1000 Lux / 320nm ~ 750nm / ±20% / Digital Output / I2C

mmWave

• FMCW / 180MHz / VCO / synthesizer
• Variable chirp 220 / 1100 / 4400μs @ 180MHz / 8m @ FOV 120°
• 2 RX antennas
• SPI / I2C

PIR

• Spectral: 8 ~ 13 µm
• FOV: 150(X.Y.) × 159(Z.)
• ADC: 14-bit
• Sensitivity: 8-bit
• Blind Time: 0.5 ~ 8 sec

TOF

• Module
  VGA 30fps / FOV 90×70 / VCSEL 850nm / VCSEL 940nm / Indoor & Outdoor
• Device
  2M RGB + ToF / USB 3.0 / Ethernet / Point Cloud / HDR / PC tool (demo)

RGB

• 2~20M / 120 fps
• SLVS-EC / SLVS / LVDS / MIPI CSI-2
• HDR / WDR / PDAF