Advanced Thermal CAE Capabilities

Ability's CAE Thermal Team offers accurate temperature and thermal risk prediction. We specialize in optimizing thermal dissipation efficiency and solutions during the design phase.

Our Services Include

Identifying system weaknesses
Ensuring uniform internal device temperatures
Verifying PCB simulation results
Evaluating external surface temperature distribution
Assessing product operating environments and setting appropriate thermal convection conditions

Identifying System Weaknesses

Optimize the Temperature Uniformity

Verifying PCB Simulation Results

A : The dense components located behind the ASIC contribute to a more uniform distribution of heat.
B : Power electronics generate high currents on printed circuit boards (PCBs), which can result in elevated temperatures.
C : Scarcity of components in this area, along with the absence of heat-emitting parts, creates a significant thermal difference.

Temperature Distribution on the Exterior Surface

Evaluate the Operating Environment

Product Test in the Application Environment

Mapping the Simulation to Obtain Numerical Parameters

Thermal Environment Reliability & Energy Technology

Our advanced tools and methods ensure precise thermal analysis and reliable results:

Data Recorder: Accurately capture temperature data at measurement points for comprehensive analysis.
Thermal Imager: Helps to understand the maximum temperature point of each measurement, providing a clear visualization of the temperature distribution.
Natural Convection Box: Provides a windy, constant temperature and humidity environment to simulate the harsh outdoor environment.
Anemometer: Measure wind speed in cars, outdoors and in offices.
Temperature Chamber: Creates a controlled environment with variable temperature and humidity to test products under different ambient conditions.